Blanket SMT With In Situ N2 Plasma Treatment on the (100) Wafer for the Low-Cost Low-Power Technology Application
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| Veröffentlicht in: | IEEE electron device letters 2009-09, Vol.30 (9), p.916-918 |
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| container_title | IEEE electron device letters |
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| creator | JUN YUAN CHAN, Victor BELYANSKY, Michael P ELLER, Manfred YONG MENG LEE CAVE, Nigel HUILING SHANG YING LI DIVAKARUNI, Rama ROVEDO, Nivo SARDESAI, Viraj KANIKE, Narasimhulu VARADARAJAN, Vidya YU, Mickey JONG HO YANG JEONG, Y. K SUNG KWON, O |
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| doi_str_mv | 10.1109/LED.2009.2025895 |
| format | Article |
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| fulltext | fulltext |
| identifier | ISSN: 0741-3106 |
| ispartof | IEEE electron device letters, 2009-09, Vol.30 (9), p.916-918 |
| issn | 0741-3106 1558-0563 |
| language | eng |
| recordid | cdi_proquest_journals_912022408 |
| source | IEEE Electronic Library (IEL) |
| subjects | Applied sciences Electronics Exact sciences and technology Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Transistors |
| title | Blanket SMT With In Situ N2 Plasma Treatment on the (100) Wafer for the Low-Cost Low-Power Technology Application |
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