Packaged photonic probes for an on-wafer broad-band millimeter-wave network analyzer
We report the fabrication of integrated and packaged active photonic probes that enable on-wafer measurements of electrical scattering parameters with a bandwidth exceeding 300 GHz. The probes use a high-speed uni-traveling-carrier photodiode (UTC-PD) to optically generate the electrical stimulus an...
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| Veröffentlicht in: | IEEE photonics technology letters 2000-09, Vol.12 (9), p.1225-1227 |
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| container_title | IEEE photonics technology letters |
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| creator | Sahri, N. Nagatsuma, T. |
| description | We report the fabrication of integrated and packaged active photonic probes that enable on-wafer measurements of electrical scattering parameters with a bandwidth exceeding 300 GHz. The probes use a high-speed uni-traveling-carrier photodiode (UTC-PD) to optically generate the electrical stimulus and the electro-optic sampling (EOS) technique to measure the electrical signals. The modules are packaged using micro-optic technology and exhibit excellent optical characteristics. They are easy to use, enable reliable and reproducible measurements, and should help to overcome the bandwidth-limitation of present all-electronic similar systems. |
| doi_str_mv | 10.1109/68.874243 |
| format | Article |
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The probes use a high-speed uni-traveling-carrier photodiode (UTC-PD) to optically generate the electrical stimulus and the electro-optic sampling (EOS) technique to measure the electrical signals. The modules are packaged using micro-optic technology and exhibit excellent optical characteristics. They are easy to use, enable reliable and reproducible measurements, and should help to overcome the bandwidth-limitation of present all-electronic similar systems.</description><identifier>ISSN: 1041-1135</identifier><identifier>EISSN: 1941-0174</identifier><identifier>DOI: 10.1109/68.874243</identifier><identifier>CODEN: IPTLEL</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Bandwidth ; Electric variables measurement ; High speed ; High speed optical techniques ; Micro-optics ; Millimeter wave measurements ; Millimeter wave technology ; Networks ; Optical device fabrication ; Optical scattering ; Packaging ; Photodiodes ; Photonics ; Probes ; Sampling ; Scattering ; Scattering parameters</subject><ispartof>IEEE photonics technology letters, 2000-09, Vol.12 (9), p.1225-1227</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. 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The probes use a high-speed uni-traveling-carrier photodiode (UTC-PD) to optically generate the electrical stimulus and the electro-optic sampling (EOS) technique to measure the electrical signals. The modules are packaged using micro-optic technology and exhibit excellent optical characteristics. They are easy to use, enable reliable and reproducible measurements, and should help to overcome the bandwidth-limitation of present all-electronic similar systems.</description><subject>Bandwidth</subject><subject>Electric variables measurement</subject><subject>High speed</subject><subject>High speed optical techniques</subject><subject>Micro-optics</subject><subject>Millimeter wave measurements</subject><subject>Millimeter wave technology</subject><subject>Networks</subject><subject>Optical device fabrication</subject><subject>Optical scattering</subject><subject>Packaging</subject><subject>Photodiodes</subject><subject>Photonics</subject><subject>Probes</subject><subject>Sampling</subject><subject>Scattering</subject><subject>Scattering parameters</subject><issn>1041-1135</issn><issn>1941-0174</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2000</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNp90T1PwzAQBmALgUQpDKxMFgOCIcVnO44zooovqRIM3SMnOUNKGhc7pSq_HlepGBiY7qR7dLrTS8g5sAkAy2-VnuhMcikOyAhyCQmDTB7GnsUeQKTH5CSEBWMgUyFHZP5qqg_zhjVdvbvedU1FV96VGKh1npqOui7ZGIuelt6ZOilNV9Nl07bNEnv0cfaFtMN-4_xH5KbdfqM_JUfWtAHP9nVM5g_38-lTMnt5fJ7ezZJKiKxPKlQCIK01MKV5mqWaaeS2yrkpFUjNRc4tIC-5zlklwXKrICIlmMgUE2NyNayNF3-uMfTFsgkVtq3p0K1DwXUKqUx38PpfCIzznEmV6Ugv_9CFW_v4Vyi0lnkutNihmwFV3oXg0RYr3yyN38ZNxS6GQuliiCHai8E2iPjr9sMfTup_og</recordid><startdate>20000901</startdate><enddate>20000901</enddate><creator>Sahri, N.</creator><creator>Nagatsuma, T.</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. 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The probes use a high-speed uni-traveling-carrier photodiode (UTC-PD) to optically generate the electrical stimulus and the electro-optic sampling (EOS) technique to measure the electrical signals. The modules are packaged using micro-optic technology and exhibit excellent optical characteristics. They are easy to use, enable reliable and reproducible measurements, and should help to overcome the bandwidth-limitation of present all-electronic similar systems.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/68.874243</doi><tpages>3</tpages></addata></record> |
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| ispartof | IEEE photonics technology letters, 2000-09, Vol.12 (9), p.1225-1227 |
| issn | 1041-1135 1941-0174 |
| language | eng |
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| source | IEEE Electronic Library (IEL) |
| subjects | Bandwidth Electric variables measurement High speed High speed optical techniques Micro-optics Millimeter wave measurements Millimeter wave technology Networks Optical device fabrication Optical scattering Packaging Photodiodes Photonics Probes Sampling Scattering Scattering parameters |
| title | Packaged photonic probes for an on-wafer broad-band millimeter-wave network analyzer |
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