Copper Electroplating from Vanadate- and Molybdate-Containing Electrolytes with Suspended Titanium Dioxide

Coatings with copper matrices, which are deposited from sulfate electrolytes modified by additions of either molybdate or vanadate ions and highly dispersed powder of titanium dioxide, are studied. The additives enhance the heat resistance of the coatings. The mentioned ions have a depolarizing effect on the cathodic deposition of copper and inhibit the codeposition of a dispersed phase of TiO^sub 2^. Molybdate ions in certain concentrations improve the brightness of the coatings, having been reduced to Mo compounds of lower oxidation degrees. The effect of the mentioned ions on the pH^sub s^ during the copper deposition is studied. The pH of the near-cathode layer is shown to somewhat increase in the presence of both molybdate ions and titanium dioxide.[PUBLICATION ABSTRACT]