Three-dimensional substrate impedance engineering based on p-/p+ Si substrate for mixed-signal system-on-chip (SoC)

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Bibliographische Detailangaben
Veröffentlicht in:	IEEE transactions on electron devices 2005-11, Vol.52 (11), p.2440-2446
Hauptverfasser:	CHONG, Kyuchul, XI ZHANG, TU, King-Ning, DAQUAN HUANG, CHANG, Mau-Chung, XIE, Ya-Hong
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Design. Technologies. Operation analysis. Testing Dielectric, amorphous and glass solid devices Electronics Exact sciences and technology Integrated circuits Magnetic devices Microelectronic fabrication (materials and surfaces technology) Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Online-Zugang:	Volltext
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