High-Speed Subcarrier Based on High-Resistivity Silicon for Long-Wavelength VCSEL Array

We propose a chip-to-chip optical interconnection using a silicon (Si) subcarrier integrated with a long-wavelength vertical-cavity surface-emitting laser (LW-VCSEL) array. As the basic study of that, we examined the microwave and optical characteristics of the Si subcarrier. Finally, a demonstrator...

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Veröffentlicht in:	IEEE photonics technology letters 2006-12, Vol.18 (23), p.2523-2525
Hauptverfasser:	Hwang, Sung Hwan, Park, Hyo-Hoon, Choi, Jung-Hwan, Rho, Byung Sup
Format:	Artikel
Sprache:	eng
Schlagworte:	Arrays Channels Chip-to-chip optical interconnection coplanar waveguide Coplanar waveguides High speed high-resistivity silicon subcarrier Interconnection Laboratories Lenses long-wavelength vertical-cavity surface-emitting laser Microwaves Optical arrays Optical films Optical interconnections Optical waveguides Silicon Subcarriers Surface emitting lasers Vertical cavity surface emission lasers Vertical cavity surface emitting lasers
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Beschreibung
Zusammenfassung:	We propose a chip-to-chip optical interconnection using a silicon (Si) subcarrier integrated with a long-wavelength vertical-cavity surface-emitting laser (LW-VCSEL) array. As the basic study of that, we examined the microwave and optical characteristics of the Si subcarrier. Finally, a demonstrator that mounted the four channels and 1550-nm LW-VCSEL array on the subcarrier has been shown with no kink L-I curves and with clear 2.5-Gb/s eye diagrams
ISSN:	1041-1135 1941-0174
DOI:	10.1109/LPT.2006.887339