Nucleation Control and Thermal Aging Resistance of Near-Eutectic Sn-Ag-Cu-X Solder Joints by Alloy Design

Elemental (X) additions to Sn-3.5Ag-0.95Cu (SAC3595) solder were developed with minimal (

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Bibliographische Detailangaben
Veröffentlicht in:	Journal of electronic materials 2009-12, Vol.38 (12), p.2770-2779
Hauptverfasser:	Anderson, Iver E., Walleser, Jason W., Harringa, Joel L., Laabs, Fran, Kracher, Alfred
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Brazing. Soldering Characterization and Evaluation of Materials Chemistry and Materials Science Condensed matter: structure, mechanical and thermal properties Electronics and Microelectronics Equations of state, phase equilibria, and phase transitions Eutectics Exact sciences and technology General studies of phase transitions Instrumentation Joining, thermal cutting: metallurgical aspects Lead free solders Materials Science Metals. Metallurgy Microstructure Nucleation Optical and Electronic Materials Physics Shear strength Shear tests Solid State Physics
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Beschreibung
Zusammenfassung:	Elemental (X) additions to Sn-3.5Ag-0.95Cu (SAC3595) solder were developed with minimal (
ISSN:	0361-5235 1543-186X
DOI:	10.1007/s11664-009-0936-7