In situ electrodeposition offline measurement method for machining gap in wire electrochemical micro-machining

Wire electrochemical micro-machining (WECMM) is a key focus in the realm of metal microstructure processing. Its primary advantage lies in the ability to mold metal micro zero devices. The precision of WECMM hinges on its processing gap, with the end gap determined by changes in slit length and the side gap by changes in slit width. Quantitative processing of WECMM can only be achieved when the rules governing these gaps are clearly understood. In classical electrolysis theory, the end gap is much smaller than the side gap, and whether the relationship between the two in the electrochemical transient reaction is also to be verified. While the side gap can be directly calculated using slit width and wire electrode diameter, the end gap requires measurement. Since the wire electrode is continuously fed during processing, online measurement of the end gap is not feasible at this stage, necessitating offline measurement with a fixed wire electrode and workpiece. This paper proposes an in situ electrodeposition method to precisely maintain the relative position between the wire electrode and the workpiece, ensuring measurement accuracy. Simulation tests optimize the deposition electric field and method while observing gap distribution after filling through three-dimensional layering validating the reliability of the in situ electrodeposition method. This enables accurate and effective measurement, clarifying the scale relationship between the end gap and the side gap. This, in turn, lays a foundation for understanding the distribution law of the processing gap and further improves the basic principle of WECMM.