Optimization of Impact Ionization in Metal–Oxide–Semiconductor Field-Effect Transistors for Improvement of Breakdown Voltage and Specific On-Resistance

For the past few decades, metal–oxide–semiconductor field-effect transistors (MOSFETs) have been the most important application in IC circuits. In certain circuit applications, the breakdown voltage and specific on-resistance serve as key electrical parameters. This article introduces a readily acce...

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Veröffentlicht in:Electronics (Basel) 2024-10, Vol.13 (20), p.4101
Hauptverfasser: Chen, Yanning, Song, Yixian, Wu, Bo, Liu, Fang, Deng, Yongfeng, Kang, Pingrui, Huang, Xiaoyun, Wu, Yongyu, Gao, Dawei, Xu, Kai
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Sprache:eng
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Zusammenfassung:For the past few decades, metal–oxide–semiconductor field-effect transistors (MOSFETs) have been the most important application in IC circuits. In certain circuit applications, the breakdown voltage and specific on-resistance serve as key electrical parameters. This article introduces a readily accessible approach to enhance the source–drain breakdown voltage (BVDS) of MOSFETs based on the Bipolar-CMOS-DMOS (BCD) platform without extra costs. By attentively refining the process steps and intricacies of the doping procedures, the breakdown voltages of NMOS and PMOS experienced increments of 3.4 V and 4.6 V, translating to enhancements of 31.5% and 50.3%. Parallel simulations offer insightful mechanistic explanations through simulation tools, facilitating superior outcomes. This initiative lays significant groundwork for the advancement of a comprehensive BCD process development framework.
ISSN:2079-9292
2079-9292
DOI:10.3390/electronics13204101