Method for Evaluating Structural Design of Impedance Bond Molded with Resin

Thermal effects on trackside signalling devices, such as high air temperature, intense sunlight, and Joule heat generated by return currents, can be tested independently. However, it is difficult to evaluate the effects of multiple sources of heat. And yet, trackside signalling devices have occasion...

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Veröffentlicht in:	Quarterly Report of RTRI 2024/05/01, Vol.65(2), pp.138-144
Hauptverfasser:	SHIOMI, Shunsuke, SHINDO, Takuro, KAMIYA, Tsuyoshi, SATO, Terutaka, OKO, Naoyuki
Format:	Artikel
Sprache:	eng
Schlagworte:	Air temperature Deformation effects effect of temperature Heat stress Impedance impedance bond Resins return current Stress analysis Structural design Temperature effects testing method Thermal simulation thermal stress analytics
Online-Zugang:	Volltext
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