Method for Evaluating Structural Design of Impedance Bond Molded with Resin

Thermal effects on trackside signalling devices, such as high air temperature, intense sunlight, and Joule heat generated by return currents, can be tested independently. However, it is difficult to evaluate the effects of multiple sources of heat. And yet, trackside signalling devices have occasionally failed due to heat, for example, deformation of the device structure because of heat. To reduce such failures, we developed a method for evaluating thermal effects on a resin-molded impedance bond using a computer simulation of heat-stress analysis. In this paper we also propose a method for evaluating thermal effects on impedance bonds through a combination of analytical and experimental methods.