Method for Evaluating Structural Design of Impedance Bond Molded with Resin
Thermal effects on trackside signalling devices, such as high air temperature, intense sunlight, and Joule heat generated by return currents, can be tested independently. However, it is difficult to evaluate the effects of multiple sources of heat. And yet, trackside signalling devices have occasion...
Gespeichert in:
| Veröffentlicht in: | Quarterly Report of RTRI 2024/05/01, Vol.65(2), pp.138-144 |
|---|---|
| Hauptverfasser: | , , , , |
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 144 |
|---|---|
| container_issue | 2 |
| container_start_page | 138 |
| container_title | Quarterly Report of RTRI |
| container_volume | 65 |
| creator | SHIOMI, Shunsuke SHINDO, Takuro KAMIYA, Tsuyoshi SATO, Terutaka OKO, Naoyuki |
| description | Thermal effects on trackside signalling devices, such as high air temperature, intense sunlight, and Joule heat generated by return currents, can be tested independently. However, it is difficult to evaluate the effects of multiple sources of heat. And yet, trackside signalling devices have occasionally failed due to heat, for example, deformation of the device structure because of heat. To reduce such failures, we developed a method for evaluating thermal effects on a resin-molded impedance bond using a computer simulation of heat-stress analysis. In this paper we also propose a method for evaluating thermal effects on impedance bonds through a combination of analytical and experimental methods. |
| doi_str_mv | 10.2219/rtriqr.65.2_138 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_journals_3104752222</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>3104752222</sourcerecordid><originalsourceid>FETCH-LOGICAL-c3028-8ab745ba8bdeb725844e6abc826c6e5bccefcaac127909ff9b9eec50638eee4a3</originalsourceid><addsrcrecordid>eNpVkElPwzAQhS0EElXpmaslzmm9xIlzA8pW0QqJ5WzZzqRNlcat7YD494QWVWIOM4f53jzNQ-iSkjFjtJj46OudH2dizBTl8gQNqJQkoXkmTtGAEM6TghB5jkYh1IYQ1heXZICeFxBXrsSV8_j-UzedjnW7xG_RdzZ2Xjf4DkK9bLGr8GyzhVK3FvCta0u8cE0JJf6q4wq_9lB7gc4q3QQY_c0h-ni4f58-JfOXx9n0Zp5YTphMpDZ5KoyWpgSTMyHTFDJtrGSZzUAYa6GyWlvK8oIUVVWYAsAKknEJAKnmQ3R1uLv1btdBiGrtOt_2lopTkuZi_90QTQ6U9S4ED5Xa-nqj_beiRP2Gpg6hqUyofWi94vqgWIeol3DktY-1beAf37declzZlfYKWv4DTzp58Q</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>3104752222</pqid></control><display><type>article</type><title>Method for Evaluating Structural Design of Impedance Bond Molded with Resin</title><source>Elektronische Zeitschriftenbibliothek - Frei zugängliche E-Journals</source><source>J-STAGE (Japan Science & Technology Information Aggregator, Electronic) Freely Available Titles - Japanese</source><creator>SHIOMI, Shunsuke ; SHINDO, Takuro ; KAMIYA, Tsuyoshi ; SATO, Terutaka ; OKO, Naoyuki</creator><creatorcontrib>SHIOMI, Shunsuke ; SHINDO, Takuro ; KAMIYA, Tsuyoshi ; SATO, Terutaka ; OKO, Naoyuki</creatorcontrib><description>Thermal effects on trackside signalling devices, such as high air temperature, intense sunlight, and Joule heat generated by return currents, can be tested independently. However, it is difficult to evaluate the effects of multiple sources of heat. And yet, trackside signalling devices have occasionally failed due to heat, for example, deformation of the device structure because of heat. To reduce such failures, we developed a method for evaluating thermal effects on a resin-molded impedance bond using a computer simulation of heat-stress analysis. In this paper we also propose a method for evaluating thermal effects on impedance bonds through a combination of analytical and experimental methods.</description><identifier>ISSN: 0033-9008</identifier><identifier>EISSN: 1880-1765</identifier><identifier>DOI: 10.2219/rtriqr.65.2_138</identifier><language>eng</language><publisher>Tokyo: Railway Technical Research Institute</publisher><subject>Air temperature ; Deformation effects ; effect of temperature ; Heat stress ; Impedance ; impedance bond ; Resins ; return current ; Stress analysis ; Structural design ; Temperature effects ; testing method ; Thermal simulation ; thermal stress analytics</subject><ispartof>Quarterly Report of RTRI, 2024/05/01, Vol.65(2), pp.138-144</ispartof><rights>2024 by Railway Technical Research Institute</rights><rights>Copyright Japan Science and Technology Agency 2024</rights><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c3028-8ab745ba8bdeb725844e6abc826c6e5bccefcaac127909ff9b9eec50638eee4a3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,776,780,1876,27903,27904</link.rule.ids></links><search><creatorcontrib>SHIOMI, Shunsuke</creatorcontrib><creatorcontrib>SHINDO, Takuro</creatorcontrib><creatorcontrib>KAMIYA, Tsuyoshi</creatorcontrib><creatorcontrib>SATO, Terutaka</creatorcontrib><creatorcontrib>OKO, Naoyuki</creatorcontrib><title>Method for Evaluating Structural Design of Impedance Bond Molded with Resin</title><title>Quarterly Report of RTRI</title><addtitle>QR of RTRI</addtitle><description>Thermal effects on trackside signalling devices, such as high air temperature, intense sunlight, and Joule heat generated by return currents, can be tested independently. However, it is difficult to evaluate the effects of multiple sources of heat. And yet, trackside signalling devices have occasionally failed due to heat, for example, deformation of the device structure because of heat. To reduce such failures, we developed a method for evaluating thermal effects on a resin-molded impedance bond using a computer simulation of heat-stress analysis. In this paper we also propose a method for evaluating thermal effects on impedance bonds through a combination of analytical and experimental methods.</description><subject>Air temperature</subject><subject>Deformation effects</subject><subject>effect of temperature</subject><subject>Heat stress</subject><subject>Impedance</subject><subject>impedance bond</subject><subject>Resins</subject><subject>return current</subject><subject>Stress analysis</subject><subject>Structural design</subject><subject>Temperature effects</subject><subject>testing method</subject><subject>Thermal simulation</subject><subject>thermal stress analytics</subject><issn>0033-9008</issn><issn>1880-1765</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2024</creationdate><recordtype>article</recordtype><recordid>eNpVkElPwzAQhS0EElXpmaslzmm9xIlzA8pW0QqJ5WzZzqRNlcat7YD494QWVWIOM4f53jzNQ-iSkjFjtJj46OudH2dizBTl8gQNqJQkoXkmTtGAEM6TghB5jkYh1IYQ1heXZICeFxBXrsSV8_j-UzedjnW7xG_RdzZ2Xjf4DkK9bLGr8GyzhVK3FvCta0u8cE0JJf6q4wq_9lB7gc4q3QQY_c0h-ni4f58-JfOXx9n0Zp5YTphMpDZ5KoyWpgSTMyHTFDJtrGSZzUAYa6GyWlvK8oIUVVWYAsAKknEJAKnmQ3R1uLv1btdBiGrtOt_2lopTkuZi_90QTQ6U9S4ED5Xa-nqj_beiRP2Gpg6hqUyofWi94vqgWIeol3DktY-1beAf37declzZlfYKWv4DTzp58Q</recordid><startdate>20240501</startdate><enddate>20240501</enddate><creator>SHIOMI, Shunsuke</creator><creator>SHINDO, Takuro</creator><creator>KAMIYA, Tsuyoshi</creator><creator>SATO, Terutaka</creator><creator>OKO, Naoyuki</creator><general>Railway Technical Research Institute</general><general>Japan Science and Technology Agency</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7TB</scope><scope>8FD</scope><scope>FR3</scope><scope>KR7</scope></search><sort><creationdate>20240501</creationdate><title>Method for Evaluating Structural Design of Impedance Bond Molded with Resin</title><author>SHIOMI, Shunsuke ; SHINDO, Takuro ; KAMIYA, Tsuyoshi ; SATO, Terutaka ; OKO, Naoyuki</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c3028-8ab745ba8bdeb725844e6abc826c6e5bccefcaac127909ff9b9eec50638eee4a3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2024</creationdate><topic>Air temperature</topic><topic>Deformation effects</topic><topic>effect of temperature</topic><topic>Heat stress</topic><topic>Impedance</topic><topic>impedance bond</topic><topic>Resins</topic><topic>return current</topic><topic>Stress analysis</topic><topic>Structural design</topic><topic>Temperature effects</topic><topic>testing method</topic><topic>Thermal simulation</topic><topic>thermal stress analytics</topic><toplevel>online_resources</toplevel><creatorcontrib>SHIOMI, Shunsuke</creatorcontrib><creatorcontrib>SHINDO, Takuro</creatorcontrib><creatorcontrib>KAMIYA, Tsuyoshi</creatorcontrib><creatorcontrib>SATO, Terutaka</creatorcontrib><creatorcontrib>OKO, Naoyuki</creatorcontrib><collection>CrossRef</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Technology Research Database</collection><collection>Engineering Research Database</collection><collection>Civil Engineering Abstracts</collection><jtitle>Quarterly Report of RTRI</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>SHIOMI, Shunsuke</au><au>SHINDO, Takuro</au><au>KAMIYA, Tsuyoshi</au><au>SATO, Terutaka</au><au>OKO, Naoyuki</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Method for Evaluating Structural Design of Impedance Bond Molded with Resin</atitle><jtitle>Quarterly Report of RTRI</jtitle><addtitle>QR of RTRI</addtitle><date>2024-05-01</date><risdate>2024</risdate><volume>65</volume><issue>2</issue><spage>138</spage><epage>144</epage><pages>138-144</pages><issn>0033-9008</issn><eissn>1880-1765</eissn><abstract>Thermal effects on trackside signalling devices, such as high air temperature, intense sunlight, and Joule heat generated by return currents, can be tested independently. However, it is difficult to evaluate the effects of multiple sources of heat. And yet, trackside signalling devices have occasionally failed due to heat, for example, deformation of the device structure because of heat. To reduce such failures, we developed a method for evaluating thermal effects on a resin-molded impedance bond using a computer simulation of heat-stress analysis. In this paper we also propose a method for evaluating thermal effects on impedance bonds through a combination of analytical and experimental methods.</abstract><cop>Tokyo</cop><pub>Railway Technical Research Institute</pub><doi>10.2219/rtriqr.65.2_138</doi><tpages>7</tpages><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0033-9008 |
| ispartof | Quarterly Report of RTRI, 2024/05/01, Vol.65(2), pp.138-144 |
| issn | 0033-9008 1880-1765 |
| language | eng |
| recordid | cdi_proquest_journals_3104752222 |
| source | Elektronische Zeitschriftenbibliothek - Frei zugängliche E-Journals; J-STAGE (Japan Science & Technology Information Aggregator, Electronic) Freely Available Titles - Japanese |
| subjects | Air temperature Deformation effects effect of temperature Heat stress Impedance impedance bond Resins return current Stress analysis Structural design Temperature effects testing method Thermal simulation thermal stress analytics |
| title | Method for Evaluating Structural Design of Impedance Bond Molded with Resin |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-25T15%3A55%3A43IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Method%20for%20Evaluating%20Structural%20Design%20of%20Impedance%20Bond%20Molded%20with%20Resin&rft.jtitle=Quarterly%20Report%20of%20RTRI&rft.au=SHIOMI,%20Shunsuke&rft.date=2024-05-01&rft.volume=65&rft.issue=2&rft.spage=138&rft.epage=144&rft.pages=138-144&rft.issn=0033-9008&rft.eissn=1880-1765&rft_id=info:doi/10.2219/rtriqr.65.2_138&rft_dat=%3Cproquest_cross%3E3104752222%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=3104752222&rft_id=info:pmid/&rfr_iscdi=true |