Residual Stress in the Carrier Tape AISI 310S at the Stage of Deposition of the YSZ Buffer Layer when Manufacturing of HTS-2G Wire

Using neutron diffraction we determined internal residual stress in the stainless steel AISI 310S carrier tape with a thickness of 100 µm and a width of 4 mm after mechanical polishing and the ABAD deposition of the textured YSZ buffer layer. It is shown that mechanical polishing causes a slight dis...

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Veröffentlicht in:	Technical physics 2024-01, Vol.69 (4), p.883-889
Hauptverfasser:	Irodova, A. V., Karpov, I. D., Kruglov, V. S., Krylov, V. E., Shavkin, S. V., Em, V. T.
Format:	Artikel
Sprache:	eng
Schlagworte:	Austenitic stainless steels Buffer layers Classical and Continuum Physics Compressive properties Deposition High temperature superconductors Mechanical polishing Neutron diffraction Physics Physics and Astronomy Residual stress Steel, Stainless Stress relaxation Tensile stress Thickness Yttria-stabilized zirconia
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container_end_page	889
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container_title	Technical physics
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creator	Irodova, A. V. Karpov, I. D. Kruglov, V. S. Krylov, V. E. Shavkin, S. V. Em, V. T.
description	Using neutron diffraction we determined internal residual stress in the stainless steel AISI 310S carrier tape with a thickness of 100 µm and a width of 4 mm after mechanical polishing and the ABAD deposition of the textured YSZ buffer layer. It is shown that mechanical polishing causes a slight distension of the tape in the rolling plane. After the deposition of the YSZ layer, uniform tensile stress of 70 MPa isotropic in the rolling plane was observed inside the tape. Calculations have shown that it results from relaxation of compressive stress acting on the surface of the tape in a layer several times thicker than the YSZ layer. It is assumed that the surface of the tape is plastically deformed during the YSZ deposition.
doi_str_mv	10.1134/S1063784224030149
format	Article
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Calculations have shown that it results from relaxation of compressive stress acting on the surface of the tape in a layer several times thicker than the YSZ layer. It is assumed that the surface of the tape is plastically deformed during the YSZ deposition.</description><subject>Austenitic stainless steels</subject><subject>Buffer layers</subject><subject>Classical and Continuum Physics</subject><subject>Compressive properties</subject><subject>Deposition</subject><subject>High temperature superconductors</subject><subject>Mechanical polishing</subject><subject>Neutron diffraction</subject><subject>Physics</subject><subject>Physics and Astronomy</subject><subject>Residual stress</subject><subject>Steel, Stainless</subject><subject>Stress relaxation</subject><subject>Tensile stress</subject><subject>Thickness</subject><subject>Yttria-stabilized zirconia</subject><issn>1063-7842</issn><issn>1090-6525</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2024</creationdate><recordtype>article</recordtype><recordid>eNp1kcFq3DAQhk1poekmD9CboGcnM5Ity8fttk0WNgTiLaG9GNkebRQ2tiPJlFzz5JGzgRxKEEga_f-n0WiS5CvCKaLIzioEKQqVcZ6BAMzKD8kRQgmpzHn-cd5Lkc765-SL93cAiCqXR8nTNXnbTXrPquDIe2Z7Fm6JrbRzlhzb6pHYcl2tmUComA4vahX0jthg2A8aB2-DHfo5mqU_1V_2fTImshv9GOd_t9SzS91PRrdhcrbfzdaLbZXyc3ZjHR0nn4zeezp5XRfJ718_t6uLdHN1vl4tN2nLRRFSLDMC2UCGouxU0UHZCN1k0pDpELTIhaIiVok5VxJFSy1vZNugyLlRJIxYJN8O945ueJjIh_pumFwfU9axNiyUKgCi6_Tg2uk91bY3Q3C6jaOje9sOPRkbz5cKVIkFL2QE8AC0bvDekalHZ--1e6wR6rk39X-9iQw_MH6cP4Tc21Peh54B2syNCQ</recordid><startdate>20240101</startdate><enddate>20240101</enddate><creator>Irodova, A. 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D.</creatorcontrib><creatorcontrib>Kruglov, V. S.</creatorcontrib><creatorcontrib>Krylov, V. E.</creatorcontrib><creatorcontrib>Shavkin, S. V.</creatorcontrib><creatorcontrib>Em, V. T.</creatorcontrib><collection>CrossRef</collection><jtitle>Technical physics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Irodova, A. V.</au><au>Karpov, I. D.</au><au>Kruglov, V. S.</au><au>Krylov, V. E.</au><au>Shavkin, S. V.</au><au>Em, V. T.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Residual Stress in the Carrier Tape AISI 310S at the Stage of Deposition of the YSZ Buffer Layer when Manufacturing of HTS-2G Wire</atitle><jtitle>Technical physics</jtitle><stitle>Tech. Phys</stitle><date>2024-01-01</date><risdate>2024</risdate><volume>69</volume><issue>4</issue><spage>883</spage><epage>889</epage><pages>883-889</pages><issn>1063-7842</issn><eissn>1090-6525</eissn><abstract>Using neutron diffraction we determined internal residual stress in the stainless steel AISI 310S carrier tape with a thickness of 100 µm and a width of 4 mm after mechanical polishing and the ABAD deposition of the textured YSZ buffer layer. It is shown that mechanical polishing causes a slight distension of the tape in the rolling plane. After the deposition of the YSZ layer, uniform tensile stress of 70 MPa isotropic in the rolling plane was observed inside the tape. Calculations have shown that it results from relaxation of compressive stress acting on the surface of the tape in a layer several times thicker than the YSZ layer. 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subjects	Austenitic stainless steels Buffer layers Classical and Continuum Physics Compressive properties Deposition High temperature superconductors Mechanical polishing Neutron diffraction Physics Physics and Astronomy Residual stress Steel, Stainless Stress relaxation Tensile stress Thickness Yttria-stabilized zirconia
title	Residual Stress in the Carrier Tape AISI 310S at the Stage of Deposition of the YSZ Buffer Layer when Manufacturing of HTS-2G Wire
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