Simulation-Based DC and RF Performance Analysis of an Enhancement-Mode T-Gate Al0.15Ga0.85N/GaN/Al0.07Ga0.93N/GaN/Al0.05Ga0.95N MIS-HEMT Device on a GaN Substrate
This paper presents a metal–insulator–semiconductor high-electron-mobility transistor (MIS-HEMT) device, operating in enhancement mode, with a double-channel triple-barrier (DCTB) Al 0.15 Ga 0.85 N/GaN/Al 0.07 Ga 0.93 N/GaN/Al 0.05 Ga 0.95 N device structure. Initially, we simulate the Al 0.15 Ga 0....
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Veröffentlicht in: | Journal of electronic materials 2024-09, Vol.53 (9), p.5555-5565 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | This paper presents a metal–insulator–semiconductor high-electron-mobility transistor (MIS-HEMT) device, operating in enhancement mode, with a double-channel triple-barrier (DCTB) Al
0.15
Ga
0.85
N/GaN/Al
0.07
Ga
0.93
N/GaN/Al
0.05
Ga
0.95
N device structure. Initially, we simulate the Al
0.15
Ga
0.85
N/GaN single-channel single-barrier (SCSB) MIS-HEMT, featuring a T-gate design that offers a significant gap between the gate and a drain electrode, resulting in a high breakdown voltage (
V
BD
) and low parasitic capacitance, enhancing cut-off frequency (
f
t
) and a maximum frequency of oscillation (
f
max
). In the current era, high breakdown voltage, high current drive, and high-frequency enhancement-mode-operated devices are needed for power switching circuits and high-frequency power amplifier applications. To meet these requirements, we propose a DCTB MIS-HEMT device structure that adds additional back-barrier layers and channel layers to form a double-hump characteristic due to the interaction between two-dimensional electron gas (2DEG) accumulation layers and the electric field across the device. We optimize the devices with an optimistic doping profile in channel and buffer layers, a field plate, recessed gate structure, and control the barrier layers thickness, ensuring enhancement-mode operation. Numerical simulations of the DCTB device provide high drain current (
I
ds
) of 1.5 A/mm, transconductance (
g
m
) of 0.232 S/mm, threshold voltage (
V
t
) of 2.8 V,
V
BD
of 633.1 V, ON resistance (
R
ON
) of 6.074 Ω mm,
f
t
of 49.8 GHz, and
f
max
of 107.8 GHz. Due to improvements in these parameters, the DCTB MIS-HEMT outperforms the SCSB MIS-HEMT, making it suitable for high-current drive, high-frequency, and high-speed switching applications. In this work, we also examine the merits of utilizing DCTB MIS-HEMT as the switching element in an ultra-low-loss boost converter circuit. |
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ISSN: | 0361-5235 1543-186X |
DOI: | 10.1007/s11664-024-11289-1 |