A Wood Chipboard Technology Using Modified Phenol and Formaldehyde Binder

A Wood Chipboard Technology Using Modified Phenol and Formaldehyde Binder

The paper examines the technology for synthesizing phenol and formaldehyde resin grade SFZh-3011 modified with fusel oil fraction (a mixture of alcohols) introduced in amounts ranging from 1 to 7% of the total reaction mass. The strength of the adhesive bond and the adhesive ability of the modified...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Polymer science. Series D, Glues and sealing materials Glues and sealing materials, 2024, Vol.17 (2), p.298-301
Hauptverfasser: Machneva, O. P., Pas’ko, Yu. V., Politaeva, L. P., Khaidarov, Kh. Zh
Format: Artikel
Sprache:eng
Schlagworte:
Adhesive bonding
Adhesive strength
Alcohols
Chemistry
Chemistry and Materials Science
Formaldehyde resins
Fusel oil
Mechanical properties
Particle board
Physical properties
Polymer Sciences
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The paper examines the technology for synthesizing phenol and formaldehyde resin grade SFZh-3011 modified with fusel oil fraction (a mixture of alcohols) introduced in amounts ranging from 1 to 7% of the total reaction mass. The strength of the adhesive bond and the adhesive ability of the modified resins were evaluated, as well as the impact of the modified binder on the physical and mechanical properties of wood chipboards.
ISSN:1995-4212
1995-4220
DOI:10.1134/S1995421224700497