From high-tech clusters to open innovation ecosystems: a systematic literature review of the relationship between science and technology parks and universities

As part of the third mission of universities to promote innovation and economic development, the popularity of science and technology parks (STPs) as a policy tool is increasing. The co-location of innovative companies and universities should be conducive to knowledge exchange between universities a...

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Veröffentlicht in:The Journal of technology transfer 2024-04, Vol.49 (2), p.689-714
Hauptverfasser: Sandoval Hamón, Leyla A., Ruiz Peñalver, Soraya M., Thomas, Elisa, Fitjar, Rune Dahl
Format: Artikel
Sprache:eng
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Zusammenfassung:As part of the third mission of universities to promote innovation and economic development, the popularity of science and technology parks (STPs) as a policy tool is increasing. The co-location of innovative companies and universities should be conducive to knowledge exchange between universities and industry, thus leading to more innovation. However, STPs have evolved in different contexts and to serve different purposes. Furthermore, the research on them has evolved mainly through case studies of individual parks and it is scattered across different disciplinary conversations. Building on 1,711 articles published from 1985 onwards, this study presents a systematic literature review of research on STPs and their relationships with universities. We find three different phases in the evolution of this literature: a formation phase (before 2000), where the focus was on the creation of STPs; a geographical expansion phase (2000–2010) reflecting the geographical expansion of STPs to East Asia and other emerging economies, with heavy focus on high-technology firms mainly in ICT; and a topical expansion phase (2011 onwards) when the literature expands to cover a diversity of new topics, including open innovation and sustainability, reflecting broader changes in the understanding of innovation.
ISSN:0892-9912
0892-9912
1573-7047
DOI:10.1007/s10961-022-09990-6