Plasma‐Based Additive Manufacturing Method for MEMS Using APSLD (Atmospheric Pressure Sputtering Layer Deposition) Technology

This paper reports a novel additive manufacturing technique for MEMS devices using newly developed APSLD (atmospheric pressure sputtering layer deposition) technology. It uses a microplasma at atmospheric pressure to deposit microstructures with defined properties, such as conducting or isolating directly at different surfaces additively without complex and time‐consuming manufacturing routes like planar technology. Feasibility tests have been successfully done to deposit metal lines, isolating and metal oxide layers on 3D surfaces to manufacture high stable MEMS sensor system for harsh environments. This is a promising technology in the field of MEMS manufacturing, as it can simplify the manufacturing process and reduce the cost. The ability to deposit different materials can expand the design possibilities for MEMS devices. © 2024 Institute of Electrical Engineer of Japan and Wiley Periodicals LLC.