Analysis of the Role of Interfacial Layer in Ferroelectric FET Failure as a Memory Cell

By observing temporary and permanent changes in threshold voltage ( {V}_{\text {T}} ) due to the application of unipolar/bipolar stress, it was confirmed that the trap-carrier interaction speed is the cause of failure of the ferroelectric transistor as a memory. As the polarization switching occurs,...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:IEEE electron device letters 2024-04, Vol.45 (4), p.562-565
Hauptverfasser: Lee, Seongwon, Kim, Haesung, Yang, Hyojin, Yun, Sanghyuk, Park, Junseong, Lee, Haneul, Park, Sejun, Choi, Sung-Jin, Kim, Dae Hwan, Kim, Dong Myong, Kwon, Daewoong, Bae, Jong-Ho
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:By observing temporary and permanent changes in threshold voltage ( {V}_{\text {T}} ) due to the application of unipolar/bipolar stress, it was confirmed that the trap-carrier interaction speed is the cause of failure of the ferroelectric transistor as a memory. As the polarization switching occurs, carriers are trapped in the ferroelectric/interfacial layer (FE/IL), and the hole trap is limited compared to the electron trap due to the slow interaction. IL degrades under bipolar stress due to the high electric field during polarization switching, leading to the acceleration of hole trapping, which has a strong impact on the memory window.
ISSN:0741-3106
1558-0563
DOI:10.1109/LED.2024.3360419