Insights into electron dynamics in two-dimensional bismuth oxyselenide: a monolayer-bilayer perspective
Bismuth oxyselenide (Bi 2 O 2 Se), an emerging 2D semiconductor material, has garnered substantial attention owing to its remarkable properties, including air stability, elevated carrier mobility, and ultrafast optical response. In this study, we conduct a comparative analysis of electron excitation...
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Veröffentlicht in: | Physical chemistry chemical physics : PCCP 2024-02, Vol.26 (6), p.5438-5446 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | Bismuth oxyselenide (Bi
2
O
2
Se), an emerging 2D semiconductor material, has garnered substantial attention owing to its remarkable properties, including air stability, elevated carrier mobility, and ultrafast optical response. In this study, we conduct a comparative analysis of electron excitation and relaxation processes in monolayer and bilayer Bi
2
O
2
Se. Our findings reveal that monolayer Bi
2
O
2
Se exhibits parity-forbidden transitions between the band edges at the
Γ
point, whereas bilayer Bi
2
O
2
Se demonstrates parity activity, providing the bilayer with an advantage in light absorption. Employing nonadiabatic molecular dynamics simulations, we uncover a two-stage hot-electron relaxation process-initially fast followed by slow-in both monolayer and bilayer Bi
2
O
2
Se within the conduction band. Despite the presence of weak nonadiabatic coupling between the CBM + 1 and CBM, limiting hot electron relaxation, the monolayer displays a shorter relaxation time due to its higher phonon-coupled frequency and smaller energy difference. Our investigation sheds light on the layer-specific excitation properties of 2D Bi
2
O
2
Se layered materials, providing crucial insights for the strategic design of photonic devices utilizing 2D materials.
There is a two-stage hot-electron relaxation process-initially fast followed by slow-in both monolayer and bilayer Bi
2
O
2
Se within the conduction band, and the monolayer displays a shorter relaxation time. |
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ISSN: | 1463-9076 1463-9084 |
DOI: | 10.1039/d3cp05357a |