Beam test results of 25 and 35 μm thick FBK ultra-fast silicon detectors

This paper presents the measurements on first very thin Ultra-Fast Silicon Detectors (UFSDs) produced by Fondazione Bruno Kessler; the data have been collected in a beam test setup at the CERN PS, using beam with a momentum of 12 GeV/c. UFSDs with a nominal thickness of 25 and 35 μ m and an area of...

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Veröffentlicht in:European physical journal plus 2023-01, Vol.138 (1), p.99, Article 99
Hauptverfasser: Carnesecchi, F., Strazzi, S., Alici, A., Arcidiacono, R., Borghi, G., Boscardin, M., Cartiglia, N., Centis Vignali, M., Cavazza, D., Dalla Betta, G. -F., Durando, S., Ferrero, M., Ficorella, F., Ali, O. Hammad, Mandurrino, M., Margotti, A., Menzio, L., Nania, R., Pancheri, L., Paternoster, G., Scioli, G., Siviero, F., Sola, V., Tornago, M., Vignola, G.
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Sprache:eng
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Zusammenfassung:This paper presents the measurements on first very thin Ultra-Fast Silicon Detectors (UFSDs) produced by Fondazione Bruno Kessler; the data have been collected in a beam test setup at the CERN PS, using beam with a momentum of 12 GeV/c. UFSDs with a nominal thickness of 25 and 35 μ m and an area of 1 × 1 mm 2 have been considered, together with an additional HPK 50- μ m thick sensor, taken as reference. Their timing performances have been studied as a function of the applied voltage and gain. A time resolution of about 25 ps and of 22 ps at a voltage of 120 and 240 V has been obtained for the 25 and 35 μ m thick UFSDs, respectively.
ISSN:2190-5444
2190-5444
DOI:10.1140/epjp/s13360-022-03619-1