Additive Manufacturing of High‐Temperature Hybrid Electronics via Molecular‐Decomposed Metals

As the modern electronic technology extends into operating in harsh working conditions, it calls for a system that is capable of uncompromising performance in extreme environments, thus providing a strong motivation to look for advanced materials and electronics with the capability of high‐throughput and rapid prototyping. Coupled with additive manufacturing, molecular decomposition metals bypass the challenging oddities of traditional material‐limited and thermally initiated metalworking, enabling high throughput and rapid prototyping of stoichiometry and composition‐controlled metals. Here, a new paradigm for the design and additive manufacturing of copper metallic alloy materials onto ceramics is described by printing molecular decomposable metal materials, capable of withstanding thermo‐mechanical loading, operating in extreme environments in static and dynamic conditions. The resulting printed hybrid electronics are electrically stable for 25 h of aging at 1000 °C. This curious fact paves a way for printed antenna and sensor electronics that reliably operate up to 1000 °C. These results can be further extended to establish other printable molecular decomposable materials as a platform for rapid prototyping of high temperature electronics that are suitable for harsh environments. Harsh operating conditions require a system capable of uncompromising performance in extreme environments. Molecular decomposition metals and additive manufacturing enable high throughput and rapid prototyping of stoichiometry and composition‐controlled copper‐based materials. The resulting Copper─Nickel hybrid is electrically stable for 25 h at 1000 °C, thus paving a way for printed antenna and sensor electronics that can reliably operate in extreme environments.