Reversible Assembly of Conductive Supragel Building Blocks by Metallo‐Complexes

Inside Front Cover: A facile method for reversible interparticle cross‐linking of vinylimidazole‐based hydrogel cubes based on transition metal complexation is presented in article 2300275 by Julian Thiele and co‐workers. By swelling preassembled hydrogels inside aqueous solutions of Zn2+, Cu2+ or Fe2+ ions, interparticle connectivity—and, exemplarily, electrical conductivity in case of Cu2+ ions—is achieved. These supragels resist mechanical forces, but can be quantitatively disassembled into single building blocks by ligand exchange