An attempt for morphology‐based quantitative prediction of adhesion strength between metal‐polymer interface

The peel‐off strength of the electroplated specimens exhibits corresponding increase, particularly pronounced in ABS‐rich blends. However, it is observed that the interface displays incomplete contact between the metal and polymer. We suggest a new parameter, the Sdr ratio (Sdr,polymer/Sdr,plating), which provides the prediction of the adhesion strength of the physically interlocked metal‐polymer interface. The change in Sdr ratio effectively reflects the change of peel‐off strength, which is more efficient for phases with increasing ABS content. By examining the relationship between surface morphology and adhesion strength, our research provides the insights into optimizing the adhesion properties of electroplated metal‐polymer interfaces for PC/ABS blend. The peel‐off strength of the electroplated specimens exhibits corresponding increase, particularly pronounced in ABS‐rich blends. However, it is observed that the interface displays incomplete contact between the metal and polymer. We suggest a new parameter, the Sdr ratio (Sdr,polymer/Sdr,plating), which provides the prediction of the adhesion strength of the physically interlocked metal‐polymer interface. The change in Sdr ratio effectively reflects the change of peel‐off strength, which is more efficient for phases with increasing ABS content. By examining the relationship between surface morphology and adhesion strength, our research provides the insights into optimizing the adhesion properties of electroplated metal‐polymer interfaces for PC/ABS blend.