Evolution of epoxy molding compounds and future carbon materials for thermal and mechanical stress management in memory device packaging: a critical review

This paper provides an overview of technical enhancements of current encapsulant materials (epoxy molding compound and underfill) and future deployment of graphene materials for better thermal and mechanical stress management in thin and complex memory packaging. Also, with the aim to study the key technical barriers, influencing of each epoxy molding compound (EMC) and underfill (UF) materials properties and its reliability performance of impacts on materials used in semiconductor device packaging, this paper lays out the importance of future graphene of its superior materials thermal dissipation and performances especially for future higher memory density and low power memory devices. This article briefly reviews key aspects of encapsulant materials reliability concerns, factors impacting package strength, package warpage and thermal dissipation for future miniatured memory device packaging.