Characterization of Cu-Ag multilayers deposited on brass substrate using electroplating technique

In this research multilayers of Copper (Cu) and Silver (Ag) have been deposited on brass substrate using electroplating process (ELP). The first layer of Cu is coated to be followed by a layer of silver, the experiments carried out in five different electroplating periods of time 2, 4, 6, 8 and 10 m...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Ali, Haider A., Aziz, Israa Abdul-Kadir, Abbas, Ahmed S.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Brasses Copper Diffraction patterns Electroplating Hardness measurement Measurement methods Microhardness Multilayers Plating Silver Substrates Surface roughness Thickness X-ray diffraction
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!