Characterization of Cu-Ag multilayers deposited on brass substrate using electroplating technique

In this research multilayers of Copper (Cu) and Silver (Ag) have been deposited on brass substrate using electroplating process (ELP). The first layer of Cu is coated to be followed by a layer of silver, the experiments carried out in five different electroplating periods of time 2, 4, 6, 8 and 10 minutes (min.). The second layer was Ag with one selected plating time 1 min. The parameters including electroplating time are studied in the experiments. The measuring methods, which consisted roughness measurement, hardness measurement, and XRD diffraction are used to characterize multilayer compared to all samples obtained. The surface electroplating compositions calculated by these methods, It was observed that a surface roughness, thickness and hardness increases with an increase in electroplating time. The results obtained show that increasing electroplating time will lead to increase the thickness layer coating. On other side increasing time of electroplating affected on increasing the surface roughness of silver surfaces roughness. While the highest micro hardness value implemented at the highest value for the coating time (10 min.). While the results of the X-ray diffraction pattern (XRD) test examination are adopted as a good evidence for the presence of Cu and Ag in both internal and external finish layers, respectively.