High temperature high voltage potting adhesive
This study presents the results of a new resin survey for potting of high voltage electronics. The main objective consists in improving the European manufacturing capability for high voltage (>6 kV) and high temperature applications (maximum temperature: 180°C). The targeted improvements include...
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Veröffentlicht in: | IOP conference series. Materials Science and Engineering 2023-08, Vol.1287 (1), p.12012 |
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Hauptverfasser: | , , , , , |
Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | This study presents the results of a new resin survey for potting of high voltage electronics. The main objective consists in improving the European manufacturing capability for high voltage (>6 kV) and high temperature applications (maximum temperature: 180°C). The targeted improvements include enhanced thermal stability and insulation properties of adhesive potting for high voltage applications for a target lifetime of 15 years. In addition, a specific attention has been given to EU sourced materials for development. Class H resins were targeted. A trade-off based on technical data sheets, tests at material, sample and breadboard levels has been conducted. The complete test sequence performed lead to identify a resin suitable for the requirements and processes. TRL4 has been reached, but there is still a long way to go and use it in a space product. The next steps are the implementation of this new resin in the current equipment and the qualification of magnetics parts impregnated or moulded with this resin. |
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ISSN: | 1757-8981 1757-899X |
DOI: | 10.1088/1757-899X/1287/1/012012 |