A Hardware Non-Invasive Mapping Method for Condition Bits in Binary Translation

Binary translation, as an important bridge for application compatibility between different instruction set architectures (ISAs), has attracted much attention in the industry. However, due to hardware resource limitations of the target ISA, the translation efficiency and the practicability are poor....

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Veröffentlicht in:Electronics (Basel) 2023-07, Vol.12 (14), p.3014
Hauptverfasser: Li, Chunqiang, Liu, Zhiwei, Shang, Yunhai, He, Lenian, Yan, Xiaolang
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Sprache:eng
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Zusammenfassung:Binary translation, as an important bridge for application compatibility between different instruction set architectures (ISAs), has attracted much attention in the industry. However, due to hardware resource limitations of the target ISA, the translation efficiency and the practicability are poor. Recently, Apple has made it possible to run x86 programs on ARM through a translation technology called Rosetta based on software-hardware collaboration. In this paper, we proposed a hardware non-invasive mapping method for condition bits (HNIMCB) in binary translation, which innovatively implements the setting and referencing operations of the condition bits without changing the original instruction encoding and function of the target processor. This method is applicable for binary translation from source architectures with condition bit operations to target architectures without condition bit operations. It eliminates the difference of conditional bit resources between the source and target ISAs, reduces the computational instructions and memory access operations after translation from the source to the target ISA, and dramatically improves the translation efficiency. We conducted this experiment on a functional simulation level using the QEMU binary translator from ARM to RISC-V. A series of benchmark tests revealed that the total number of instructions decreased by 41%, while the number of memory access instructions decreased by 37% after the translation applying with the HNIMCB.
ISSN:2079-9292
2079-9292
DOI:10.3390/electronics12143014