Facile synthesis of novel Cu0@SiO2 adsorbents derived from rice husk for highly efficient capture iodine gas
Exploring novel iodine sorbent with high efficiency and low cost is a meaningful and challenging topic. Herein, a series of iodine sorbents Cu 0 @SiO 2 were firstly prepared by using SiO 2 derived from rice husks as support materials. The obtained Cu 0 @SiO 2 materials were employed to capture iodin...
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Veröffentlicht in: | Journal of sol-gel science and technology 2023-08, Vol.107 (2), p.503-511 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | Exploring novel iodine sorbent with high efficiency and low cost is a meaningful and challenging topic. Herein, a series of iodine sorbents Cu
0
@SiO
2
were firstly prepared by using SiO
2
derived from rice husks as support materials. The obtained Cu
0
@SiO
2
materials were employed to capture iodine gas. The effects of Cu content, contact time and adsorption temperature on the iodine adsorption behavior were investigated. The I
2
adsorption capacity of Cu
0
@SiO
2
reached up to 1105 mg/g with short time at 200 °C. The high chemical iodine adsorption ratio (95.11%) was achieved. Furthermore, the iodine capture mechanism for Cu
0
@SiO
2
was mainly chemical, that is formation of stable CuI by chemical reaction between Cu
0
and I
2
. The results demonstrated that Cu
0
@SiO
2
derived from rice husk was a potential promising adsorbent owing to the low cost and high capture efficiency.
Graphical Abstract
Novel Cu
0
@SiO
2
with high I
2
adsorption capacity and low cost was facilely fabricated using rice husk-based SiO
2
as support. I
2
adsorption capacity of Cu
0
@SiO
2
reached up to 1105 mg/g. The high chemical iodine adsorption ratio (95.11%) was achieved. Adsorption mechanism was that Cu
0
reacted with I
2
to form stable CuI.
Highlights
Novel Cu
0
@SiO
2
with high I
2
adsorption capacity and low cost was reported.
Cu
0
@SiO
2
was facilely fabricated using rice husk-based SiO
2
as support.
I
2
adsorption capacity of Cu
0
@SiO
2
reached up to 1105 mg/g.
The high chemical iodine adsorption rate (95.11%) was achieved.
Adsorption mechanism was that Cu
0
reacted with I
2
to form stable CuI. |
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ISSN: | 0928-0707 1573-4846 |
DOI: | 10.1007/s10971-023-06100-2 |