HJT shingle modules reliability and temperature coefficients

This work presents a large-scale study with more than 230 samples designed to optimize and characterize shingle cell interconnection with heterojunction cell technology (HJT). This interconnection technology is one of the key tracks to enhance module efficiency since it combines high performance solar cells and high-density module integration. To enhance the competitiveness of shingling both in terms of cost and environmental footprint, we explore the impact of wafer thickness reduction, HJT cell architecture and cell-to-cell overlap on the initial performance and reliability in thermal cycling (TC). In the second part of the paper, we have compared the temperature coefficients at different irradiance levels of HJT modules with standard and shingled interconnection as well as commercial PERC shingled modules to assess whether HJT cells retain their low temperature coefficient despite the dicing steps providing feedback on cell and module architecture.