A Bidirectional Deep Learning Approach for Designing MEMS Sensors

To achieve the desired characteristics for MEMS sensors, the traditional design process obtains the geometrical parameters based on complex theoretical calculations and interactive finite-element (FE) simulations, which are time consuming and data consuming. To solve the above problems, a data-drive...

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Veröffentlicht in:IEEE transactions on computer-aided design of integrated circuits and systems 2023-05, Vol.42 (5), p.1610-1617
Hauptverfasser: Cheng, Xiong, Zhang, Pengfei, Zhou, Yiqi, Sun, Daying, Gu, Wenhua, Yue, Yutao, Huang, Xiaodong
Format: Artikel
Sprache:eng
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Zusammenfassung:To achieve the desired characteristics for MEMS sensors, the traditional design process obtains the geometrical parameters based on complex theoretical calculations and interactive finite-element (FE) simulations, which are time consuming and data consuming. To solve the above problems, a data-driven bidirectional design approach based on the deep learning (DL) method is introduced to improve the design efficiency of MEMS sensors in this work. By using the piezoresistive acceleration sensor as a design example, the forward artificial neural network (ANN) with the sensor geometrical parameters as the input and the sensor performance as the output is trained and realized by using 1000 groups of data collected through FE simulation. This forward ANN can accurately predict the sensor performance, including the measurement range, sensitivity, and resonant frequency. In addition, the inverse ANN with the sensor performance as the input and the sensor geometrical parameters as the output is also achieved by using a tandem network. This inverse ANN can provide the geometrical parameters directly and instantly according to the target performance. Both the forward and inverse networks cost only about 6 ms for each task and the mean relative errors are less than 3%. The high efficiency and low relative error indicate that DL is a promising approach to improve the design efficiency for MEMS sensors.
ISSN:0278-0070
1937-4151
DOI:10.1109/TCAD.2022.3199965