Controlled synthesis of ultrathin metallic MoO2 nanosheets for van der Waals contact
Van der Waals contact through assembly of two-dimensional (2D) semiconductors with metallic materials by van der Waals force is considered as one of the most promising methods to solve the contact problem in 2D-material-based electronics. However, the previous studies mostly focused on semiconductor...
Gespeichert in:
Veröffentlicht in: | Science China materials 2023-04, Vol.66 (4), p.1504-1510 |
---|---|
Hauptverfasser: | , , , , , , , , , |
Format: | Artikel |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | Van der Waals contact through assembly of two-dimensional (2D) semiconductors with metallic materials by van der Waals force is considered as one of the most promising methods to solve the contact problem in 2D-material-based electronics. However, the previous studies mostly focused on semiconductor materials, while the preparation and properties of metallic materials have been less studied. In this paper, we reported a controlled synthesis of metallic layered MoO
2
flakes with thicknesses of 3.5 to 106.8 nm using the chemical vapor deposition method. X-ray diffraction, scanning tunneling microscopy, and transmission electron microscopy were used to characterize the fabricated MoO
2
nanoplates. The results indicate that the samples have a monoclinic crystal structure with high crystal quality and stability. The electrical characterization reveals an excellent conduction behavior of thin MoO
2
flakes with a conductivity exceeding 10
6
S m
−
1
, which is comparable to those of graphene and some metals. In addition, we explored the contact applications of thin MoO
2
flakes in a MoS
2
field-effect transistor (FET) by introducing MoO
2
flakes as a van der Waals contact. High carrier mobility combined with an optimized Schottky barrier height was achieved in the designed MoS
2
FET. This study provides new insights into the preparation as well as application of metallic materials and is expected to promote the development of 2D-material-based electronics. |
---|---|
ISSN: | 2095-8226 2199-4501 |
DOI: | 10.1007/s40843-022-2260-6 |