Fabrication of Freestanding Double-sided Through-hole Electrode Films using Imprint Technique
Recently, flexible electronic devices such as printed electronics have attracted attention. Interposers are required to flexibly connect circuit devices. However, most conventional interposers are not flexible because they are composed of silicon or glass substrates. To solve this problem, we develo...
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| Veröffentlicht in: | Journal of Photopolymer Science and Technology 2022/12/16, Vol.35(2), pp.131-134 |
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| container_title | Journal of Photopolymer Science and Technology |
| container_volume | 35 |
| creator | Furuta, Atsuhiro Taniguchi, Jun |
| description | Recently, flexible electronic devices such as printed electronics have attracted attention. Interposers are required to flexibly connect circuit devices. However, most conventional interposers are not flexible because they are composed of silicon or glass substrates. To solve this problem, we developed a manufacturing process for flexible interposers. We used photolithography to fabricate columnar master molds with diameters of 10 μm and 20 μm. After applying a release agent to the master molds, hole patterns were produced using UV nanoimprint lithography. The holes were filled with silver ink. The flexible interposer was then completed. |
| doi_str_mv | 10.2494/photopolymer.35.131 |
| format | Article |
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Photopol. Sci. Technol.</addtitle><description>Recently, flexible electronic devices such as printed electronics have attracted attention. Interposers are required to flexibly connect circuit devices. However, most conventional interposers are not flexible because they are composed of silicon or glass substrates. To solve this problem, we developed a manufacturing process for flexible interposers. We used photolithography to fabricate columnar master molds with diameters of 10 μm and 20 μm. After applying a release agent to the master molds, hole patterns were produced using UV nanoimprint lithography. The holes were filled with silver ink. The flexible interposer was then completed.</description><subject>Circuits</subject><subject>Electronic devices</subject><subject>Flexible through electrode</subject><subject>Glass substrates</subject><subject>Molds</subject><subject>Nanoimprint lithography (NIL)</subject><subject>Nanolithography</subject><subject>Photolithography</subject><subject>Release agents</subject><subject>Silicon substrates</subject><subject>Through hole</subject><issn>0914-9244</issn><issn>1349-6336</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2022</creationdate><recordtype>article</recordtype><recordid>eNplkE1Lw0AQQBdRsFZ_gZcFz6n7mWSPUo0WCl7qUZbN7qRJSbJ1Nzn035vSUgRPc3lvZngIPVKyYEKJ533tB7_37aGDsOByQTm9QjPKhUpSztNrNCOKikQxIW7RXYw7QjiXUs3Qd2HK0FgzNL7HvsJFAIiD6V3Tb_GrH8sWktg4cHhTBz9u66T2LeC3FuwQvANcNG0X8RiP_Krbh6Yf8AZs3Tc_I9yjm8q0ER7Oc46-irfN8iNZf76vli_rxAqZD4l13FHhROasyK2sLINKZsTkpQNlq5wZIRWhFKSUTknLlBSEGkPyVJFSKD5HT6e9--Cns3HQOz-GfjqpWZanGZOUHSl-omzwMQao9PRuZ8JBU6KPHfXfjppLPXWcrOJk7aYuW7g4JgyNbeGfw87iBbC1CRp6_guIToWv</recordid><startdate>20221216</startdate><enddate>20221216</enddate><creator>Furuta, Atsuhiro</creator><creator>Taniguchi, Jun</creator><general>The Society of Photopolymer Science and Technology(SPST)</general><general>Japan Science and Technology Agency</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7SR</scope><scope>7U5</scope><scope>8FD</scope><scope>JG9</scope><scope>L7M</scope></search><sort><creationdate>20221216</creationdate><title>Fabrication of Freestanding Double-sided Through-hole Electrode Films using Imprint Technique</title><author>Furuta, Atsuhiro ; Taniguchi, Jun</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c458t-cd3d14d47dc48c5fc2ef570a8bde9cf82a459011e555d95c295401aa08690b493</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2022</creationdate><topic>Circuits</topic><topic>Electronic devices</topic><topic>Flexible through electrode</topic><topic>Glass substrates</topic><topic>Molds</topic><topic>Nanoimprint lithography (NIL)</topic><topic>Nanolithography</topic><topic>Photolithography</topic><topic>Release agents</topic><topic>Silicon substrates</topic><topic>Through hole</topic><toplevel>online_resources</toplevel><creatorcontrib>Furuta, Atsuhiro</creatorcontrib><creatorcontrib>Taniguchi, Jun</creatorcontrib><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Journal of Photopolymer Science and Technology</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Furuta, Atsuhiro</au><au>Taniguchi, Jun</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Fabrication of Freestanding Double-sided Through-hole Electrode Films using Imprint Technique</atitle><jtitle>Journal of Photopolymer Science and Technology</jtitle><addtitle>J. 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| identifier | ISSN: 0914-9244 |
| ispartof | Journal of Photopolymer Science and Technology, 2022/12/16, Vol.35(2), pp.131-134 |
| issn | 0914-9244 1349-6336 |
| language | eng |
| recordid | cdi_proquest_journals_2786725129 |
| source | J-STAGE (Japan Science & Technology Information Aggregator, Electronic) Freely Available Titles - Japanese; EZB-FREE-00999 freely available EZB journals; Free Full-Text Journals in Chemistry |
| subjects | Circuits Electronic devices Flexible through electrode Glass substrates Molds Nanoimprint lithography (NIL) Nanolithography Photolithography Release agents Silicon substrates Through hole |
| title | Fabrication of Freestanding Double-sided Through-hole Electrode Films using Imprint Technique |
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