Fabrication of Freestanding Double-sided Through-hole Electrode Films using Imprint Technique

Recently, flexible electronic devices such as printed electronics have attracted attention. Interposers are required to flexibly connect circuit devices. However, most conventional interposers are not flexible because they are composed of silicon or glass substrates. To solve this problem, we developed a manufacturing process for flexible interposers. We used photolithography to fabricate columnar master molds with diameters of 10 μm and 20 μm. After applying a release agent to the master molds, hole patterns were produced using UV nanoimprint lithography. The holes were filled with silver ink. The flexible interposer was then completed.