Low temperature interfacial reaction in 3D IC nanoscale materials

In this review, we cover copper-to-copper (Cu-to-Cu) direct bonding, point contact reaction between silicon (Si) nanowire and metal nanowire, and cold welding of gold (Au) and silver (Ag) nanowires. All of them occur under nanoscale interfaces at low temperatures. For a broader consideration, becaus...

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Veröffentlicht in:Materials science & engineering. R, Reports : a review journal Reports : a review journal, 2022-10, Vol.151, p.100701, Article 100701
Hauptverfasser: Liu, Yingxia, Lu, Yang, Tu, K.N.
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Lu, Yang
Tu, K.N.
description In this review, we cover copper-to-copper (Cu-to-Cu) direct bonding, point contact reaction between silicon (Si) nanowire and metal nanowire, and cold welding of gold (Au) and silver (Ag) nanowires. All of them occur under nanoscale interfaces at low temperatures. For a broader consideration, because Cu is known to exhibit significant anti-pathogen and anti-viral properties, the interfacial reaction in Cu nano-grain metallurgy may be used to manufacture Cu and Cu alloy products to reduce virus transmission, which can have a very large impact to our society. Furthermore, in the future semiconductor technology, because of dense packaging, Joule heating will be serious. Thus, low entropy production process will receive attention, which means low temperature joining technology such as cold welding and nano-welding will be important.
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All of them occur under nanoscale interfaces at low temperatures. For a broader consideration, because Cu is known to exhibit significant anti-pathogen and anti-viral properties, the interfacial reaction in Cu nano-grain metallurgy may be used to manufacture Cu and Cu alloy products to reduce virus transmission, which can have a very large impact to our society. Furthermore, in the future semiconductor technology, because of dense packaging, Joule heating will be serious. 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subjects Bonding
Cold welding
Copper
Copper base alloys
Cu-to-Cu direct bonding
Disease control
Gold
Integrated circuits
Interface reactions
Low temperature
Metallurgy
Nano welding
Nanowires
Ohmic dissipation
Point contact
Point contact reaction
Pulley-type contacts
Resistance heating
Silicon
Silver
Surface creep
title Low temperature interfacial reaction in 3D IC nanoscale materials
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