Time-dependent crack growth mechanism in Ni-based single crystal superalloys at high-temperature

The microscopic mechanism of time-dependent crack growth (TDCG) in single crystal (SC) Ni-based superalloys under a relatively high-temperature condition (900 °C) is critically investigated. Two alloy types are compared: alloy A containing 3% rhenium (Re) and alloy B containing no Re. With an initial stress intensity (K) value of 40 MPam1/2, both alloys show similar two step TDCG, i.e. a steady stage followed by an acceleration stage. The total life to failure (tf) of alloy B is, however, an order of magnitude shorter than alloy A. In addition to the conventional fractography, cross-sectional analyses (EBSD and EDS) are also conducted for an interrupted crack tip. Two distinct fracture modes are then identified in both alloys: {111} twin-induced shear fracture and non-crystallographic fracture along dendrite boundaries. The twin systems observed are the secondary ones having a relatively smaller Schmid factor compared to the primary ones that remain inactive under the tension. In the case of alloy A, the twin induces local phase transformation involving TCP precipitation, decomposition of γ (Ni)/γ’ (Ni3Al) structure and recrystallization, which eventually enhances local ductility and dominates the crack growth rate. In the case of alloy B, the macroscopic appearances of these fracture modes are much the same, but they are significantly facilitated by micro-voids formed exclusively in γ channel whose stability is much lower than that in alloy A. The apparently brittle TDCG nature of alloy B compared to alloy A can be interpreted as an enhanced localization of plasticity at the crack tip.