In situ synthesize Bi nanostructures on copper foam toward efficient electrocatalytic hydrogen evolution reaction

Hydrogen evolution reaction through electrical dissociation of water in an alkaline medium with high stability and current density has remained challenging due to catalyst activity and stability of the water dissociation process. Therefore, the direct implementation of hydrogen electroreduction in a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Chemical papers 2023-02, Vol.77 (2), p.859-866
Hauptverfasser: Asaadi Zahraei, Ayda, Yaghobi, Roya, Golmohammad, Mohammad
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Hydrogen evolution reaction through electrical dissociation of water in an alkaline medium with high stability and current density has remained challenging due to catalyst activity and stability of the water dissociation process. Therefore, the direct implementation of hydrogen electroreduction in an alkaline environment with stable, high electrochemical rate, and cost-effective catalysts are among critical research areas and must be further developed to address the energy crisis. Herein, we have presented a high-performance Bismuth–Copper electrocatalyst through an easy in-situ reaction between Bismuth (Bi) and Copper (Cu). The SEM images showed ultra-tiny needle-like Bi growth on Cu foam. The porous structure of the Bi–Cu configuration possesses a high surface area which has accelerated mass and charge transport phenomena. It resulted in a large surface area and high electrochemical reduction of water at a current density of 1000 mA cm −2 at low overpotential and small onset potential. We propose that the unique porous morphology and specific surface morphology of the Bi/Cu foam catalyst are beneficial to the in situ generation of Hydrogen intermediates, which might play a significant role in enhancing the H 2 electrocatalysis performance.
ISSN:0366-6352
1336-9075
2585-7290
DOI:10.1007/s11696-022-02519-z