SoIC_H Technology for Heterogeneous System Integration

A System on Integrated Chip_Horizontal (SoIC_H) technology for heterogeneous system integration in high-performance computing (HPC) is proposed. Compute logic chiplets and memory cubes are tightly integrated on a Si interposer via ultrafine pitch SoIC bond to provide low parasitic and high density i...

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Bibliographische Detailangaben

Veröffentlicht in:	IEEE transactions on electron devices 2022-12, Vol.69 (12), p.7167-7172
Hauptverfasser:	Yu, Douglas C. H., Wang, Chuei-Tang, Lin, Chia-Chia, Lu, Chih-Hsin, Wu, Gene, Huang, Chien-Yuan, Chen, Wei-Ting, Ku, Terry, Yee, Kuo-Chung, Tsai, Chung-Hao
Format:	Artikel
Sprache:	eng
Schlagworte:	Cubes Die forming Fanout High performance computing Low temperature Optimization Random access memory Silicon Static random access memory Thermal resistance Ultrafines
Online-Zugang:	Volltext
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