A dielectrophoresis proof of concept of polystyrene particles and in‐vitro human epidermal keratinocytes migration for wound rejuvenation
Diabetes affects approximately 170 million people worldwide, is expected to double by 2030, and is a severe problem. Electrical stimulation (ES) via dielectrophoresis (DEP) technique may be an effective alternative in enhancing healing rates in diabetic patients with open ulcers. This research used...
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Veröffentlicht in: | Journal of applied polymer science 2022-11, Vol.139 (44), p.n/a |
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Sprache: | eng |
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Zusammenfassung: | Diabetes affects approximately 170 million people worldwide, is expected to double by 2030, and is a severe problem. Electrical stimulation (ES) via dielectrophoresis (DEP) technique may be an effective alternative in enhancing healing rates in diabetic patients with open ulcers. This research used DEP force (FDEP) to manipulate 3.2, 4.8, 10, and 15 μm polystyrene (PS) particles to predict the migration capability of human epidermal keratinocytes (HEKs). A numerical modeling method, MyDEP, was used to predict the interpretation of Clausius–Mossotti factors of PS particles and HEKs. The finite element method computes the electric field intensity and particle trajectory based on DEP and drag forces in their respective medium. DEP experiments on numerous size PS particles and alive HEKs were carried out in a tapered aluminium microelectrode array using a non‐uniform electric field. The distinct PS particles exhibit positive DEP (PDEP), crossover frequency (fXO), and negative DEP (NDEP), whereas the HEKs experience, only NDEP due to its high conductive medium in frequency ranges from 100 kHz to 1 MHz. Finally, the DIPP‐MotionV analysis shows that particle mobility between speed and acceleration is statistically considerable. When an appropriate frequency is applied to HEKs in random locations, the FDEP aligns at the desired target position based on its dielectric properties, which accelerates wound healing in in‐vivo conditions. |
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ISSN: | 0021-8995 1097-4628 |
DOI: | 10.1002/app.53096 |