Optimization of Pool Boiling Heat Transfer on microporous metal coating surfaces with FC-72 as a working fluid

Attributing to its exceptional heat transfer coefficient (HTC), pool boiling heat transfer is one of the most popular heat transfer mechanisms for dissipating a large amount of heat on a smaller cooling space for achieving the cooling in the electronic devices. The main effort of this study is to provide an experimental observation on pool boiling heat transfer on Cu-plain surfaces by applying microporous coating surface layers having thickness in the range (70, 100, 140, and 170 µm) as well as two different sizes of particle (5, 25 µm) were tested. For the particle size of 5 µm, it was investigated that the pool boiling HTC on 70 µm coated surface is 1.5 times higher than that on Cu-plain surface, pool boiling HTC on 100 µm coated surface is 2 times higher than that on Cu-plain surface, pool boiling HTC on 140 µm coated surface is 2.4 times higher than that on Cu-plain surface, and pool boiling HTC on 170 µm coated surface is 1.8 times higher than that on Cu-plain surface. It was also recorded that the enhancement in critical heat fluxes (CHF s ) on those enhanced surfaces were 21%, 13%, 35%, and 56% respectively. For the particle size of 25 µm, the test results illustrate that pool boiling HTC on 70 µm coated surface is 1.9 times higher than that on Cu-plain surface, pool boiling HTC on 100 µm coated surface is 1.81 times higher than that on Cu-plain surface, pool boiling HTC on 140 µm coated surface is 1.98 times higher than that on Cu-plain surface, and pool boiling HTC on 170 µm coated surface is 10% lower than that on Cu-plain surface, whereas, the enhancement in CHF s on those enhanced surfaces were 35.8%, 51%, 55%, and 43% respectively. The results of this study can be further applied on two-phase heat transfer products to enhance their performance.