Polyol and polyurethane containing bisphenol‐Z: Synthesis and application for toughening epoxy

Despite their excellent properties, epoxy resins have the disadvantage of low toughness. With the aim to improve the toughness of epoxy resin, polyol and polyurethane are synthesized using bisphenol‐Z (BPZ). The synthesized material is dispersed in the epoxy resin and used as a toughening agent. Pol...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Journal of applied polymer science 2022-11, Vol.139 (42), p.n/a
Hauptverfasser: Lee, Da Young, Kim, Hye Jin, Kim, Hyeon‐Gook, Lim, Choong‐Sun, Chung, Ildoo, Seo, Bongkuk
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Despite their excellent properties, epoxy resins have the disadvantage of low toughness. With the aim to improve the toughness of epoxy resin, polyol and polyurethane are synthesized using bisphenol‐Z (BPZ). The synthesized material is dispersed in the epoxy resin and used as a toughening agent. Polyol (modified bisphenol‐Z [MBPZ]‐OH) is synthesized by a ring‐opening polymerization of propylene oxide and caprolactone, and polyurethane (MBPZ‐PU) is synthesized by a one‐shot method using MBPZ‐OH and hexamethylene diisocyanate (HMDI). The effect of MBPZ‐PU on the mechanical strength of the epoxy resin is analyzed by monitoring the flexural and impact characteristics. The addition of the synthesized MBPZ‐PU improves the tensile strength, flexural strength, flexibility, and impact strength of the cured epoxy composite. Field‐emission scanning electron microscopy measurements indicate that the fracture surface had a specific pattern. Thermal properties such as the curing temperature, glass transition temperature (Tg), and modulus are investigated through differential scanning calorimetry, dynamic mechanical analysis, and thermomechanical analysis. Based on the results, MBPZ‐PU is expected to be applied to a wider field for increasing the toughness of epoxy.
ISSN:0021-8995
1097-4628
DOI:10.1002/app.53013