Experimental Analysis of the Effect of Shape of Shock Current Pulses on the Thermal State of a Semiconductor Device

The effect of shape of shock current pulses on the thermal state of a semiconductor device has been experimentally analyzed. The technological process of changing the parameters of a device under the action of disturbing factors has been described. Based on the heat-balance equation, the analytical expression to estimate the temperature of a semiconductor chip has been obtained. The experimental dependences that characterize a change in the parameters of the device under the influence of shock current pulses with various shapes has been presented. The characteristics of the device when using sinusoidal current pulses and dc pulses have been compared.