Meringue‐Inspired Fabrication of Highly Thermally Conductive BNNSs/SiCNWs/Epoxy Composites with Shape‐Programmable 3D Networks

The construction of effective heat transfer routines is becoming more important because of the fast development of modern electronics. However, traditional network templates with fixed size cannot meet the various demands on the shape of products. Herein, a facile construction of a shape‐programmable 3D thermal network for epoxy composites is provided from the inspiration of meringue. Driven by the synergistic effect of silicon carbide nanowires (SiCNWs) and boron nitride nanosheets (BNNSs), the thermal conductivity (TC) of BNNSs/SiCNWs/epoxy composites with a 3D network is successfully enhanced to 0.69 W m–1 K–1 at low filler content (2.78 wt%), 3.8 times in comparison with neat epoxy, and the η (TC efficiency of filler) reaches 101. Meanwhile, the mechanical and thermal properties of composites are also enhanced (E' from 2.47 GPa (epoxy) to ≈3.50 GPa, Tg from 123 to 137 °C at 2.78 wt% BNNSs/SiCNWs content). This method may offer a promising prospect for the application in thermal management fields. Enlightened from the 3D‐cream status during the protein foaming process, the shape‐programmable 3D thermal network is fabricated in boron nitride nanosheets/silicon carbide nanowires/epoxy composites, dramatically enhancing the thermal conductivity and mechanical properties and breaking the barrier by the diversity requirements in applications.