Crystallographic texture of tape substrates for HTSC from Cu-40%Ni alloy with additives of refractory elements

The texture of deformation and primary recrystallization in copper-nickel alloys with the addition of a small amount of refractory elements such as Nb, Mo, Ta and W was studied. Based on the X-ray analysis of the deformation texture using the orientation distribution function, it was shown that the volume fraction of the C and S components in alloys is greater than the double volume fraction of the unfavorable component B. In accordance with this criterion, after primary recrystallization in all the studied alloys, a sharp cubic texture {100} was obtained with a volume fraction in the± 10° region of more than 95%. Alloying with refractory elements significantly increases the strength of the base copper-nickel alloy by the mechanism of solid-solution hardening. The evaluation of the mechanical characteristics showed that the increase in the yield stress in the studied alloys is from 25% to 45% with relative to Cu-40% Ni alloy. •Doping of the Cu-Ni HTSC substrate with a small amount of refractory elements.•Tape substrates were obtained by cold rolling and recrystallization annealing.•Textural analysis of the tapes was carried out using the ODF and EBSD methods.•The ratio of components in rolling texture is a criterion for obtaining sharp cube texture.•Mechanical characteristics of tape substrates made of ternary alloys are analyzed.