Recent Advances and Trends in Multiple System and Heterogeneous Integration With TSV-Less Interposers

Recent Advances and Trends in Multiple System and Heterogeneous Integration With TSV-Less Interposers

In this study, the recent advances and trends in multiple system and heterogeneous integration with through-silicon via (TSV)-less interposer (organic interposer or 2.3-D IC integration) will be investigated. Emphasis is placed on the definition, kinds, advantages and disadvantages, challenges (oppo...

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Veröffentlicht in:IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2022-08, Vol.12 (8), p.1271-1281
1. Verfasser: Lau, John H.
Format: Artikel
Sprache:eng
Schlagworte:
23-D IC integration
Integrated circuits
Interconnections
Manufacturing
Metals
multiple system and heterogeneous integration
Packaging
Substrates
through-silicon via (TSV)-less interposer
Through-silicon vias
Trends
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Beschreibung
Zusammenfassung:In this study, the recent advances and trends in multiple system and heterogeneous integration with through-silicon via (TSV)-less interposer (organic interposer or 2.3-D IC integration) will be investigated. Emphasis is placed on the definition, kinds, advantages and disadvantages, challenges (opportunities), and examples of multiple system and heterogeneous integration with TSV-less interposer. Also, some recommendations of 2.3-D IC integration will be provided.
ISSN:2156-3950
2156-3985
DOI:10.1109/TCPMT.2022.3194374