Study on Novel Heterogeneous Packaging Material and Housing Design for Spaceborne T/R Module
A novel double-layer structure heterogeneous packaging material SiCp/Al+Si/Al was proposed. The packaging shell of X-band active phased array radar transmit/receive module for aerospace was developed. The deformation control, heat dissipation and anti-mechanical environment analysis of micro-assembl...
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| Veröffentlicht in: | IOP conference series. Materials Science and Engineering 2019-12, Vol.677 (2), p.22092 |
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| container_title | IOP conference series. Materials Science and Engineering |
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| creator | Jiang, Shouli Leng, Tongtong Li, Jia Zhong, Jianfeng Gu, Yeqing Wang, Richu |
| description | A novel double-layer structure heterogeneous packaging material SiCp/Al+Si/Al was proposed. The packaging shell of X-band active phased array radar transmit/receive module for aerospace was developed. The deformation control, heat dissipation and anti-mechanical environment analysis of micro-assembly welding process were studied. The test and analysis results show that, compared with conventional materials, it has less deformation in the welding process with low temperature co-fired ceramics printed circuit boards. It has the advantages of laser capping, low expansion, high thermal conductivity and high reliability, and can meet the requirements of spaceborne power module packaging applications. |
| doi_str_mv | 10.1088/1757-899X/677/2/022092 |
| format | Article |
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The packaging shell of X-band active phased array radar transmit/receive module for aerospace was developed. The deformation control, heat dissipation and anti-mechanical environment analysis of micro-assembly welding process were studied. The test and analysis results show that, compared with conventional materials, it has less deformation in the welding process with low temperature co-fired ceramics printed circuit boards. It has the advantages of laser capping, low expansion, high thermal conductivity and high reliability, and can meet the requirements of spaceborne power module packaging applications.</description><identifier>ISSN: 1757-8981</identifier><identifier>EISSN: 1757-899X</identifier><identifier>DOI: 10.1088/1757-899X/677/2/022092</identifier><language>eng</language><publisher>Bristol: IOP Publishing</publisher><subject>Aluminum ; Circuit boards ; Deformation ; Laser beam welding ; Low temperature ; Modules ; Packaging design ; Particulate composites ; Phased arrays ; Radar arrays ; Silicon carbide ; Superhigh frequencies ; Thermal conductivity</subject><ispartof>IOP conference series. Materials Science and Engineering, 2019-12, Vol.677 (2), p.22092</ispartof><rights>Published under licence by IOP Publishing Ltd</rights><rights>Published under licence by IOP Publishing Ltd. This work is published under http://creativecommons.org/licenses/by/3.0/ (the “License”). 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| source | Institute of Physics Open Access Journal Titles; Institute of Physics IOPscience extra; EZB-FREE-00999 freely available EZB journals; Free Full-Text Journals in Chemistry |
| subjects | Aluminum Circuit boards Deformation Laser beam welding Low temperature Modules Packaging design Particulate composites Phased arrays Radar arrays Silicon carbide Superhigh frequencies Thermal conductivity |
| title | Study on Novel Heterogeneous Packaging Material and Housing Design for Spaceborne T/R Module |
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