Study on Novel Heterogeneous Packaging Material and Housing Design for Spaceborne T/R Module

A novel double-layer structure heterogeneous packaging material SiCp/Al+Si/Al was proposed. The packaging shell of X-band active phased array radar transmit/receive module for aerospace was developed. The deformation control, heat dissipation and anti-mechanical environment analysis of micro-assembly welding process were studied. The test and analysis results show that, compared with conventional materials, it has less deformation in the welding process with low temperature co-fired ceramics printed circuit boards. It has the advantages of laser capping, low expansion, high thermal conductivity and high reliability, and can meet the requirements of spaceborne power module packaging applications.