Sol–gel encapsulation for power electronics utilizing 3-Glycidyloxypropyltriethoxysilane and 3-Mercaptopropyltrimethoxysilane

3-Glycidyloxypropyltriethoxysilane and 3-Mercaptosilane were used to prepare a composite together with aluminum oxide. The compound is a potential candidate for being used as inorganic encapsulation. FTIR results paired with head-space analysis revealed a hardening of the composite at above 130 °C a...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	Journal of sol-gel science and technology 2022-09, Vol.103 (3), p.832-842
Hauptverfasser:	Kohler, Tobias, Hejtmann, Georg, Henneck, Stefan, Schubert, Martin, Guyenot, Michael
Format:	Artikel
Sprache:	eng
Schlagworte:	Activation energy Adhesion Aluminum oxide Bond energy Ceramics Chemistry and Materials Science Composites Condensates Copper Dipole interactions electronic Encapsulation Glass High temperature Inorganic Chemistry magnetic and ferroelectric applications Materials Science Nanotechnology Natural Materials Optical and Electronic Materials Original Paper: Sol-gel and hybrid materials for dielectric Room temperature Shear strength Shear tests Silver Sol-gel processes Temperature Thermal analysis
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!