Topology for Substrate Routing in Semiconductor Package Design

In this work, we propose a new signal routing method for solving routing problems that occur in the design process of semiconductor package substrates. Our work uses a topological transformation of the layers of the package substrate in order to simplify the routing problem into a problem of connect...

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Veröffentlicht in:	Computer aided design 2022-08, Vol.149, p.103269, Article 103269
Hauptverfasser:	Seong, Rak-Kyeong, Yang, Jaeho, Han, Sang-Hoon
Format:	Artikel
Sprache:	eng
Schlagworte:	Algorithms Geometric topology Semiconductor package design Straight lines Substrate routing Substrates Topology
Online-Zugang:	Volltext
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