Topology for Substrate Routing in Semiconductor Package Design
In this work, we propose a new signal routing method for solving routing problems that occur in the design process of semiconductor package substrates. Our work uses a topological transformation of the layers of the package substrate in order to simplify the routing problem into a problem of connect...
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Veröffentlicht in: | Computer aided design 2022-08, Vol.149, p.103269, Article 103269 |
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Sprache: | eng |
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Zusammenfassung: | In this work, we propose a new signal routing method for solving routing problems that occur in the design process of semiconductor package substrates. Our work uses a topological transformation of the layers of the package substrate in order to simplify the routing problem into a problem of connecting points on a circle with non-intersecting straight line segments. The circle, which we call the Circular Frame, is a polygonal schema, which is originally used in topology to study the topological structure of 2-manifolds. We show through experiments that our new routing method based on the Circular Frame competes with certain grid-based routing algorithms.
•The proposed geometric transformation simplifies substrate routing problems in semiconductor package design.•The proposed geometric transformation maps a substrate layer to a topologically equivalent representation of the original environment.•The new environment guarantees full connection during the routing process without the need of rip-out and reroute mechanisms.•The proposed topological router is faster and more reliable than standard grid-based routers used for substrate design. |
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ISSN: | 0010-4485 1879-2685 |
DOI: | 10.1016/j.cad.2022.103269 |