Study of fiber delamination on silane modified ramie fiber/OMMTnano‐clay epoxy composite under low‐velocity impact, shear load, and high‐speeddrilling

In this present study, the effect of silane treated ramie fiber addition along with organically‐modified montmorillonite (OMMT) nano clay in epoxy resin composite was investigated in drop load impact, shear loading, and high‐speed drilling. The main aim of this research study was to develop a high‐l...

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Veröffentlicht in:Polymer composites 2022-07, Vol.43 (7), p.4280-4287
Hauptverfasser: Sivaperumal, R., Jancirani, J., Vasanthan, B., Jeevamalar, J.
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Sprache:eng
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Zusammenfassung:In this present study, the effect of silane treated ramie fiber addition along with organically‐modified montmorillonite (OMMT) nano clay in epoxy resin composite was investigated in drop load impact, shear loading, and high‐speed drilling. The main aim of this research study was to develop a high‐laminar shear strength epoxy structural composite for various engineering applications. To improve the laminar adhesion the fiber was treated using silane via acid hydrolysis technique. The OMMT nanoclay also added with fiber in order to improve the load bearing effect and adhesion phenomenon. The composites were prepared using hand layup method with postcuring. The adhesion behavior of composites was tested based on American society for testing and materials standards and compared. According to the results, the treated ramie fiber possesses high resistance to impact loading. The ballistic resistance of composite is increased three fold when compare with as‐received fiber‐epoxy composites. The interlaminar shear strength of composite designation C1.5 gives highest shear strength of 35 MPa. The drilling study revealed highest dimensional stability for treated fiber. No fiber chip off and pull out at the drilled hole surface. The fractography analysis confirms no lamina delamination occurs even at high‐speed drilling. These delamination resistance epoxy‐based composites are suitable in automobile, structural and defense gadget manufacturing applications.
ISSN:0272-8397
1548-0569
DOI:10.1002/pc.26688